Nyhed: Kommende hardware lanceringer 2019-2021

Diverse d.  03. maj. 2019, skrevet af Burgurne 8 Kommentarer.  Vist: 1255 gange.

I denne artikel, som www.techpowerup.com regelmæssigt opdaterer, opretholdes en voksende liste over oplysninger vedrørende kommende hardwareudgivelser baseret på lækager og officielle meddelelser, som de ser dem. Der vil naturligvis være masser af rygter om ikke-udgivet hardware, og det er deres mål at basere listen på deres års erhvervserfaring - og udelukke de vanvittige. Ud over disse kommende hardware release nyheder, vil de regelmæssigt tilpasse strukturen i deres artikel for bedre at organisere information. Hver gang der foretages en vigtig ændring af denne artikel, vises den på deres forside https://www.techpowerup.com/ med et "nyt" banner, og tilføjelserne bliver dokumenteret i forumkommentaren. Denne artikel lækker ikke information, de underskrev en NDA for. Under hver enhed er der et link "Sources", der linker til en af deres artikler om netop denne enhed/standard.



AMD Ryzen 50th Anniversary

  • Release Date: 2nd half of 2019
  • Processor is called "AMD Ryzen 7 2700X Gold Edition"
  • Same specs as Ryzen 7 2700X
  • Integrated Heatspreader (IHS) comes with a signature of AMD's CEO, Dr. Lisa Su
  • Comes bundled with two games (Division 2 & World War Z), Lisa Su signature sticker and AMD T-Shirt
  • Priced around $340 ($45 higher than original Ryzen 7 2700X)
  • Sources

AMD Ryzen 3000 APUs (Picasso)

  • Release Date: Q2 or Q3 2019 (probably around Computex)
  • Based on the same Zen+ as Ryzen 2000 non-APU processors
  • 12 nanometer production process at GlobalFoundries
  • SKUs: Ryzen 3 3200G and Ryzen 5 3400G
  • DDR4 memory
  • Thermal paste used as IHS interface (not soldered)
  • Sources

AMD Zen 2 / Ryzen 3000 (Matisse) [updated]

  • Release Date: sample in 2018, launch in 2019
  • Renoir APUs expected for 2020
  • Client-segment Ryzen 3000-series launch probably at Computex 2019 (June)
  • 7 nm production process at TSMC
  • 7 nm brings 2x density, 1/2 power (at same performance), or 1.25x performance (at same power)
  • Claims better performance/watt than Intel 10 nm
  • Floating point unit doubled to 256-bit
  • AMD South Korea confirmed the existence of Ryzen 5 3600X and Ryzen 7 3700X (contest asking people to correctly guess the Cinebench scores of the two chips)
  • EPYC SKUs come with up to 64 cores, using four to eight 7 nm CPU dies (each has 8 cores)
  • The CPU dies are connected to a central IO die, which is still made on 14 nm
  • L3 Cache per CCX doubled (16x 16 MB on 8-chiplet 64-core Rome CPU)
  • Adds support for PCI-Express 4.0 (128 lanes total: 96-lanes on EPYC from the CPU + 32 from the Southbridge)
  • EPYC parts use an 8-channel DDR4 memory interface
  • Infinity Fabric can be clocked at memory clock or half memory clock (new)
  • Major update to the microarchitecture, including IPC improvements
  • New front end with improved branch-predictor, faster instruction prefetch, large L1 and L2 cache
  • Codename: Matisse (CPU), Renoir (APU w/ IGP)
  • Platform codename: Valhalla
  • Hardening against Meltdown/Spectre (through architecture)
  • Adds new instructions: Cache Line Write Back (CLWB), Read Processor ID (RDPID), and Write Back and Do Not Invalidate Cache (WBNOINVD)
  • 13% IPC gain over Zen+, 16% over Zen 1
  • Some applications are 29% faster than Zen 1
  • Continues to use socket AM4
  • Tape-out: end of 2018
  • Engineering Sample 2D3212BGMCWH2_37 / 34_N: 12c/24t, 3.4 GHz base, 3.6 GHz boost, 105 W TDP, 32 MB L3 cache
  • Socket AM4 package a multi-chip module of 2-3 dies, an I/O controller die and 1 or 2 eight-core "Zen 2" CPU complex dies, each talking to the other over Infinity Fabric.
  • AMD CES 2019 demo with 8-core/16-thread Ryzen 3000 AM4 prototype beats Core i9-9900K in multi-threaded Cinebench.
  • Sources

AMD Zen 3 [updated]

  • Release Date: 2020
  • Codename: Vermeer (CPU), Dali (APU w/ IGP)
  • Server platform codename "Milan"
  • New process tech: 7 nm+
  • Uses EUV (extreme ultraviolet) silicon fabrication node at TSMC
  • 20% increase in transistor density, 10% lower power consumption
  • Energy-efficiency prioritized, only minor improvements in IPC over Zen 2
  • New CPU core
  • Continues to use socket AM4
  • Sources

AMD Zen 4

  • Release Date: Unknown
  • "In Design" as of Nov 2018
  • Sources

AMD Threadripper 3rd Gen

  • Release Date: 2019
  • Codename: Castle Peak
  • New process tech
  • New CPU core
  • Stays on socket TR4
  • Sources

Intel "Lakefield" Heterogenous processor

  • Release Date: unknown
  • Uses 10 nanometer production process
  • A rendition of ARM big.LITTLE, but with Intel x86 cores
  • One large performance core combined with four low-power cores, and power-gating added to the mix
  • Big core is Sunny Cove based, small cores are Gracemont based
  • Integrated Gen11 iGPU
  • Fully integrated chipset and network interfaces
  • Package designed for PoP (package over package) setups with DRAM and NAND flash chips over Foverous packaging
  • Target devices include tablets and tablet+notebook convertibles
  • Project Athena is an industry-wide effort involving a dozen companies to develop the next step in powerful mobile computing, rivaling the Ultrabook development a decade ago
  • Sources

Intel Comet Lake [updated]

  • Release Date: 2019
  • Introduces 10-core CPUs
  • Uses 14 nm production process
  • Socket LGA1151
  • No significant architectural changes expected over "Coffee Lake"
  • Adds BFLOAT16 deep learning boost instructions
  • Same cache hierarchy, with 256 KB per core L2 cache, and 20 MB shared L3 cache
  • Developed to counter AMD's Zen 2
  • Sources

Intel Cannon Lake

  • Release Date: Additional processors delayed to 2019
  • One mobile SKU launched in May: Core i3-8121U 2.2 GHz, no integrated graphics
  • Core M3 8114Y: 1.5 GHz base, 2.2 GHz boost, 4.5 W TDP, Intel UHD iGPU
  • 10 nanometer production process
  • DDR4L support
  • Intel is reportedly having difficulties ramping up 10 nm, which could lead to delays
  • Adds AVX512 instructions (so far available only on HEDT platform, since Skylake-X). New instructions: AVX512F, AVX512CD, AVX512DQ, AVX512BW, and AVX512VL. New commands: AVX512_IFMA and AVX512_VBMI
  • Sources

Intel Cascade Lake [released]

  • Released: April 3, 2019
  • Server/Enterprise version of Whiskey Lake
  • Same microarchitecture as Coffee Lake
  • Still on 14 nm, using a slightly improved process
  • 56 cores spread across two dies, using multi-chip-module
  • FC-BGA package (not socketed), 5,903-pins
  • Adds support for Optane Persistent Memory
  • 12 memory channels per CPU (six per die)
  • 88 PCI-Express lanes
  • Mitigations for recent Intel vulnerabilities
  • Supports AVX-512 and AES-NI
  • Deep Learning Boost (Variable Length Neural Network Instructions)
  • Intel Speed Select to select specific multipliers for CPU cores on running system, without reboot
  • Sources

Intel Cascade Lake-X [added]

  • Release Date: 2019
  • Same feature set as Cascade Lake but using LGA2066 platform
  • Sources

Intel Cooper Lake

  • Release Date: 2019
  • Refresh of Cascade Lake
  • 14 nanometer production process
  • Uses same socket and platform
  • Deep Learning Boost gets additional instructions (compared to Cascade Lake): BFLOAT16
  • Higher clock speeds
  • Sources

Intel Ice Lake [updated]

  • Release Date: Late 2019, desktop 2020
  • Uses 10 nanometer DUV (deep-ultraviolet) process
  • Uses a brand-new CPU core design codenamed "Sunny Cove"
  • Adds AVX512 instructions (so far available only on HEDT platform, since Skylake-X). New instructions: AVX512F, AVX512CD, AVX512DQ, AVX512BW, and AVX512VL. New commands: AVX512_IFMA and AVX512_VBMI
  • 20-30 broadening of various number crunching resources, wider execution window, more AGUs
  • SHA-NI and Vector-AES instruction sets, up to 75% higher encryption performance vs. "Skylake"
  • Supports unganged memory mode
  • First implementation will not be for a desktop processor, but a low-power SOC for notebooks (Ice Lake-U)
  • Ice Lake-U is 4-core/8-thread based on Sunny Cove w/ Gen 11 GT2 graphics with 64 EUs.
  • Ice Lake SP are Xeons, which will launch in 2020.
  • Integrated GPU based on new Gen11 architecture, up to 1 TFLOP/s ALU compute performance
  • Integrated GPU supports DisplayPort 1.4a and DSC for 5K and 8K monitor support
  • Gen11 also features tile-based rendering, one of NVIDIA's secret-sauce features
  • Integrated GPU supports VESA adaptive V-sync, all AMD FreeSync-capable monitors should work with this
  • Sources

Intel Willow Cove and Golden Cove Cores

  • Release Date: 2020 and 2021
  • Succeeds "Sunny Cove"
  • Willow Cove improves on-die caches, adds more security features, and takes advantage of 10 nm+ process improvements to increase clock speeds versus Sunny Cove
  • Golden Cove will add significant single-thread (IPC) increases over Sunny Cove, add on-die matrix multiplication hardware, improved 5G network-stack HSP performance, and more security features than Willow Cove
  • Sources

New 28-core HEDT platform derived from LGA3467

  • Released as Xeon W-3175X, priced at $3,000, 255 W TDP, 3.1 GHz Base, 4.1 GHz Boost
  • Core i9-9990XE: OEM-only, $2,300, 14c/28t, 4 GHz Base, 5.1 GHz Boost, 19.25 MB Cache, 255 W TDP
  • Core i9-9980XE: 18c/36t, 3 GHz Base, 4.5 GHz Boost, 24.75 MB Cache, 165 W TDP
  • Core i9-9940X: 14c/28t, 3.3 GHz Base, 4.4 GHz Boost, 19.25 MB Cache, 165 W TDP
  • Client-segment implementation of the Skylake XCC die
  • No STIM
  • Up to 28 cores: 16-core, 24-core, 26-core, and 28-core SKUs possible
  • HyperThreading available
  • Six-channel DDR4 Memory interface, Up to 768 GB non-ECC memory
  • Uses new X599 chipset, new motherboards required
  • 44 PCIe gen 3.0 lanes
  • Two AVX-512 FMA Units
  • 14 nm++ process
  • Confirmed Motherboard: ASUS ROG Dominus Extreme
  • Sources

Graphics / GPUs

NVIDIA GeForce GTX 1650 Ti [added]

  • Release Date: Probably 2nd half of 2019
  • Price: between $170 and $200
  • Based on 12 nm Turing TU117 silicon with all shaders unlocked
  • 1024 CUDA cores, 32 ROPs, 64 TMUs
  • 4 GB GDDR5 128-bit memory at 8000 MHz (same as GTX 1650)
  • Lacks Raytracing and DLSS
  • No reference design from NVIDIA
  • Sources

NVIDIA GeForce GTX 1650 [launched]

  • Release Date: April 23rd, 2019
  • Price: $150
  • Based on 12 nm Turing TU117 silicon
  • Lacks Raytracing and DLSS
  • Fewer CUDA cores than GTX 1660 Ti (896 to 1024)
  • 1485 MHz GPU frequency, 1665 MHz Boost
  • 75 W TDP
  • Possibly smaller/slower memory, or different memory type
  • No reference design from NVIDIA
  • Our GeForce GTX 1650 reviews: EVGA SC Ultra BlackPalit StormX OCASUS STRIX OCMSI Gaming X
  • Sources

NVIDIA GeForce GTX 1660 [launched]

NVIDIA GeForce RTX 2070 Ti

  • Gigabyte (where "2070 Ti" originated from), now claims that this was just a typo
  • Release Date: Unknown
  • Based on Turing TU104 (same as RTX 2080)
  • Faster than GTX 1070 Ti and GTX 1080
  • Pricing $600-650 (ie, half of RTX 2080 Ti)


NVIDIA GeForce RTX 2050

  • Release Date: 2019
  • Based on new, smaller, chip
  • Looks like this was scrapped in favor of GTX 1660 and GTX 1650
  • Sources


  • Architecture launched with $3000 Titan V
  • Seems to be a dead end, now with Turing being the newer architecture and already released


  • Release Date: 2018
  • Possibly scrapped due to end of mining boom
  • Sources


  • Release Date: Unknown
  • Successor to Vega 20
  • Sources

AMD Navi [updated]

  • Release Date: 2019, probably H2, could launch at Computex
  • Possibly delayed to October 2019
  • Successor for "Polaris" (not a super high-end SKU)
  • Chip codenames: Navi 16, Navi 12, Navi 10, and Navi 9
  • At least one SKU uses GDDR6
  • Dual BIOS
  • Device ID: 0x73101002.
  • TSMC, 7 nm
  • Sources

AMD Arcturus

  • Release Date: 2020
  • TSMC, 7 nm+
  • Sources

Intel XE Discrete Graphics [updated]

  • First Intel Discrete GPU since ill-fated Larrabee
  • New architecture built from the ground up, and not an upscale of Gen11
  • Could be produced at Samsung to leverage their 10 nm tech, while Intel ramps up its own
  • Double-digit TFLOP/s scaling all the way up to 0.1+ PFLOP/s
  • Will be used in upcoming Cray Aurora Supercomputer for Argonne National Laboratory in 2021
  • Targeting a wide segment of markets, including consumer (client-segment) graphics, enthusiast-segment, and data-center compute
  • Uses new graphics control panel that's being introduced during 2019
  • Sources

Intel Discrete GPU / Arctic Sound

  • Release Date: 2020
  • Intel will hold a world tour in 2019, to build enthusiasm for the new architecture
  • Advanced management for power and clocks
  • Test chip: 8x8 mm² die area, 1.54B transistors, 14 nm, 50-400 MHz clock, EUs at 2x clock if needed
  • Raja Koduri who left AMD in late 2017 is somehow involved
  • Confirmed to support VESA Adaptive Sync
  • Sources

Intel Jupiter Sound

  • Release Date: 2022
  • Discrete GPU
  • Produced on 10 nanometer production process
  • Successor to Arctic Sound
  • Sources


Intel X399

  • Release Date: unknown
  • Supports Coffee Lake-X and Cannon Lake-X
  • Sources

Intel X599

  • Release Date: Unknown
  • Supports new Intel 28-core HEDT platform
  • New motherboards, with new socket: LGA3647
  • Based on C629 Server Chipset
  • 6-channel memory
  • 48 PCIe lanes
  • Sources

Intel Z399

  • Release Date: Unknown
  • New HEDT chipset
  • Sibling chipset to X599
  • Socket LGA2066
  • For 20- and 22-core CPUs
  • Works with existing Skylake-X LCC and HCC chips
  • Sources

AMD X499 Chipset

  • Release Date: Q1 2019
  • Supports Threadripper
  • Unknown changes
  • Sources

AMD X570 Chipset [updated]

  • Release Date: mid-2019, at the same time as Zen 2 (Ryzen 3000)
  • Socket AM4
  • Backwards compatible with older Ryzen processors
  • AMD's own design — does not use ASMedia IP (to avoid security vulnerabilities)
  • Supports PCI-Express 4.0
  • ASUS Motherboard models: Crosshair VIII Formula, Crosshair VIII Hero, Crosshair VIII Hero WiFi, CrossHair VIII Impact, X570 STRIX-E, STRIX-F, STRIX-I (mini-ITX), WS X570-ACE (workstations). Prime X570-Pro, X570-P, TUF X570-Plus and TUF X570-Plus WiFi
  • ASRock Motherboard models: X570 Taichi, X570 Phantom Gaming X, Phantom Gaming 6, Phantom Gaming 4, X570 Extreme 4, X570 Pro 4, X570M Pro 4.
  • Sources

AMD Z490 Chipset

  • Unknown release date
  • Looks to be cancelled, in favor of Zen 2 / X570
  • Increases number of downstream PCIe lanes by adding four PCIe Gen 3 lanes on top of the existing eight PCIe Gen 2 lanes
  • Other features identical to X470
  • Sources


DDR5 System Memory

  • Release Date: Late 2019/2020
  • JEDEC standard not fully complete yet, expected for summer 2018
  • Demo'd in May 2018 by Micron: DDR5-4400
  • Samsung 16 Gb DDR5 DRAM developed since February 2018
  • Samsung has completed functional testing and validation of a LPDDR5 prototype: 10 nm class, 8 Gbit, final clocks: DDR5-5500 and DDR5-6400
  • SK Hynix has 16 Gb DDR5-5200 samples ready, 1.1 V, mass production expected 2020
  • 4800 - 6400 Mbps
  • Expected to be produced using 7 nm technologies
  • 64-bit link at 1.1 V
  • Voltage regulators on the DIMM modules
  • Sources

HBM2e Graphics Memory [added]

  • Release Date: 2019
  • Offers 3.2 Gbps per pin (33% faster than HBM2)
  • Samsung Flashbolt: 16 Gb per die, 8-layers stacked, 16 GB per chip with 410 GB/s bandwidth
  • Sources

HBM3 Graphics Memory

  • Release Date: Not before 2019
  • Double the memory bandwidth per stack (4000 Gbps expected)
  • Expected to be produced using 7 nm technologies
  • Sources

Silicon Tech

TSMC 5 nanometer

  • Release Date: Unknown
  • Risk production as of Q2 2019
  • Uses TSMC's second implementation of EUV (Extreme Ultra Violet)
  • Up to 1.8x the density of 7 nm
  • +15% higher clocks
  • Sources

Samsung 5 nanometer

  • Release Date: Unknown
  • Ready for customer sample production as of Q2 2019
  • Uses EUV (Extreme Ultra Violet)
  • Up to 25% the density of 7 nm
  • 20% lower power consumption
  • 10% higher performance
  • Sources

Samsung 6 nanometer

  • Release Date: Unknown
  • First product taped out as of Q2 2019
  • Uses EUV (Extreme Ultra Violet)
  • Special variant for customers
  • Sources


Hynix 4D NAND

  • Release Date: H1 2019
  • Developed by SK Hynix
  • Sampling in Q4 2018
  • Reduces chip physical size, while increasing capacity at the same time
  • Supports TLC and QLC
  • 30% higher write and 25% higher read performance
  • 1.2 V
  • 1st generation: 96 stacks, 1.2 Gbps per pin, 512 Gbit TLC
  • 128 stacks in development, scales up to 512 stacks
  • Sources

Toshiba XL-Flash

  • Developed by Toshiba
  • Uses existing SLC flash technology to improve latencies
  • 1/10th the read latency of TLC
  • Good for random IOPS and better QoS at shallow queue depth
  • Can combine SLC and TLC/QLC for tiered, cost-optimized storage
  • Intel Optane memory competitor
  • Sources

Toshiba 128-layer 3D NAND Flash [added]

  • Release Date: 2020 or 2021
  • Developed by Toshiba and partner Western Digital
  • Called BiCS 5
  • Cells are TLC (not QLC)
  • Chip density: 512 Gb
  • Write performance per channel doubled to 133 MB/s
  • Sources

Intel CXL Interconnect [added]

  • New interconnect for high-bandwidth devices like GPUs
  • Targeted at enterprise and servers
  • Competitor to NVLink, Infinity Fabric and PCI-Express
  • Uses PCIe physical layer
  • Link layer designed for low latency
  • 32 Gbps per lane, per direction (Like PCIe Gen 5.0)
  • Sources

PCI-Express 4.0

  • Specification released in late 2017
  • 16 GT/s bandwidth per lane, per direction (2x the bandwidth of PCIe 3.0)
  • Reduced latency
  • Lane margining
  • I/O virtualization capabilities
  • Will be supported by AMD Zen 2 and Vega 20 (Radeon Instinct MI60 & MI50)
  • Sources

PCI-Express 5.0

  • Release Date: Q1 2019
  • 32 GT/s bandwidth per lane, per direction (4x the bandwidth of PCIe 3.0)
  • 128/130 bit encoding (= 1.5% overhead)
  • Physical connector targeted to be backward compatible
  • Sources


Kilde: www.techpowerup.com 


04-05-2019 12:21:21

Fin oversigt! :)


I min optik er de mest spændende udgivelser Ryzen 3000 serien og Navi grafikkort. Hvor meget AMD kan få ud af 7nm og hvilke optimeringer de har gjort - både på CPU og GPU fronten. Der løber rygter om at Navi sigter efter 1080/2070 ydelse til 250$, hvilket vil være halv pris af RTX2070, så det vil virkelig kunne mærkes i markedet. Vi trænger så hårdt til at få et ryk i ydelse/pris. Hele RTX serien rykkede jo intet ved ydelse/pris, men udbød bare samme ydelse til samme pris og så introducerede endnu højere priser på dem med højere ydelse.

04-05-2019 12:46:53

Delvis enig med #2.

Den nye CPU serie og GPU fra AMD er osse det eneste jeg ser frem til på den korte bane.

Jeg tillader mig dog og have en god sund portion skepsis vedr. rygter og "hype" og vil kun se de kolde kontante facts inden jeg træffer en beslutning om opgradering eller ikke. Vi har jo set i hvordan AMD's reklame division har det med at omgås sandheden lidt lemfældigt, for at sige det mildt.

Jeg er så lige modsat #2 i opfattelsen af highend produkterne og især priserne på dem, der ser jeg priserne som ganske fornuftige. 

Vil du have det bedste af det bedste, så må du bare til muffen, da det ikke er et produkt der er lavet til masserne, men for de få, som både kan og vil betale for dem. 

At midend så egentlig kommer til og hænge lidt i suppen, det er der bare ikke noget at gøre ved, og så kan man da lade dem få de forbedringer 1-2 år længere ned af vejen, det ser jeg intet som helst problem i.

Det eneste vedr. Navi som jeg er interesseret i, er topproduktet, alt det andet midend interesserer mig overhovedet ikke, og så er prisen på grisen sådan set lidt ligegyldig hvis bare ydelsen er som jeg forventer det.

04-05-2019 13:47:29

Kommende hardware lanceringer 2019-2021

Læs mere her: https://hwt.dk/nyhed/25681/nyh... Skrev Burgurne d. 03-05-2019 22:52:02

En rigtig fin oversigt af kommende hardware release, tusind tak.



04-05-2019 14:02:14

#2 Min anke går ikke så meget på prisen i sig selv, men ydelse/pris forholdet fra generation til generation.


2080 har samme ydelse som 1080Ti til samme pris. De koster faktisk 1000 kr. mere end 1080Ti gjorde!

2070 = 1080 i både ydelse og pris



Radeon VII blev også lanceret til 700$ med 1080Ti ydelse. Samme pris som 1080Ti blev lanceret til - bare 2 år efter 1080Ti... Vil man have "1080Ti ydelse" har dette ydelsesniveau kostet det samme i årevis. 1080Ti udkom for 2 år siden, og der er intet i de nye udgivelser der har rykket ved at det er ydelsen du får til den pris. 2080Ti yder bedre, men koster så også langt langt mere.


I min optik skal en ny generation gerne give højere ydelse til samme pris, eller samme ydelse til lavere pris. Så længe det er samme ydelse til samme pris er der ikke rigtig vundet noget.

Svaret blev redigeret 3 gange, sidst af KleitusIV d. 04-05-2019 14:05:15.

04-05-2019 14:18:51

Godt der sker lidt i det mindste, efter som jeg planlægger at pensionere X58 i løbet af næste år.


Men hvad jeg vælger afhænger af hvad der overclock best, dog nok mest vigtigt hvad der performer best i spil. Efter som spil er det mest krævene jeg laver på min PC gennerelt, dog vil jeg gerne på en af de store platforme igen da jeg har været rigtig glad for de udviede upgraderings muligheder som X58 har tilbudt med hen blink på f.eks. flere core i CPU. Så jeg tænker jeg ender op på enten AMD threadripper eller intels HEDT platform.

04-05-2019 23:14:36

Velbekomme #3. 🙂

05-05-2019 10:10:14

To ting jeg ser frem til er de nye Threadripper og Navi. Hvis de te er som 2070 til 250$ og så igen understøtter Crossfire, så skal jeg have to eller tre og lave nogle spændene 3dmark resultator 😁

05-05-2019 20:19:32

#7 Rygterne lyder på 2070 = 1080 = Vega64 ydelse. Du har jo 2x Vega64 i forvejen så hvis rygterne taler sandt bliver der ikke rigtig noget ydelse at hente for dig. Det kan så være på strøm/varme, men brugtpriserne på dine Vega64 kommer nok til at lide hvis rygterne holder. 🙂